Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1987-07-30
1989-06-06
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 58, 29830, 29831, B05D 512
Patent
active
048370509
ABSTRACT:
A method is described for producing electrically conductive circuits on a print base board having a copper lamination attached on one side face thereof, and more particularly relates to such method for producing the circuits of excellent electrical conductivity by effectively utilizing a newly developed electrically conductive copper paste which is specifically adapted to metal plating, wherein at least two-layer circuits are formed on one side of the base board, of which a first-layer circuit having a plurality of electrodes and a second-layer circuit having a plurality of ring-shaped electrodes formed in connection with the electrodes of the first-layer circuits, each electrode of the second-layer circuit being defined by outer and inner circumferences with a central opening defined by the inner circumference, such that the metal plating applied to the electrodes of the first- and second-layer circuits with a predetermined thickness of the metal plating layer may provide an electrically conductive path between the two circuits including an elongated total length of the metal plating layer connected to the first-layer circuit, the metal plating layer having an enlarged sectional area to increase the electrical conductivity and to increase the adherence force of the second-layer circuit to the first-layer circuit.
REFERENCES:
patent: 3214827 (1965-11-01), Prohofsky
patent: 3680209 (1972-08-01), Hacke
patent: 3831270 (1974-08-01), Huddleston
patent: 4353816 (1982-10-01), Iwasa
patent: 4438560 (1984-03-01), Kisters
patent: 4683653 (1987-08-01), Iwasa
patent: 4724040 (1988-02-01), Iwasa
Iwasa Yamahiro
Morooka Isao
Oba Yoichi
Asahi Chemical Research Laboratory Co., Ltd.
Beck Shrive
Dang Vi Duong
Ziems Robert F.
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