Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2004-02-19
2008-03-11
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S764000, C361S765000, C361S784000
Reexamination Certificate
active
07342803
ABSTRACT:
A chip capacitor20is provided in a core substrate30of a printed circuit board10. This makes it possible to shorten a distance between an IC chip90and the chip capacitor20and to reduce loop inductance. Since the core substrate30is constituted by providing a first resin substrate30a, a second resin substrate30band a third resin substrate30cin a multilayer manner, the core substrate30can obtain sufficient strength.
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Asai Motoo
Inagaki Yasushi
Shirai Seiji
Wang Dongdong
Yabashi Hideo
Dinh Tuan T.
IBIDEN Co., Ltd.
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