Semiconductor device and printed circuit board

Details Semiconductor device and printed circuit board Semiconductor device and printed circuit board

2005-03-31

2008-03-25

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S770000, C361S774000

Reexamination Certificate

active

07349224

ABSTRACT:
For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost located ball pad on the interposer substrate. With this arrangement, the length of a plating stub can be considerably reduced, and the adverse affect on a signal waveform can be minimized. This arrangement is especially effective for differential signal lines.

REFERENCES:
patent: 6403895 (2002-06-01), Sota
patent: 6800814 (2004-10-01), Ohsaka
patent: 7259467 (2007-08-01), Inagawa
patent: 2005/0039947 (2005-02-01), Ohsaka
patent: 2001-110927 (2001-04-01), None

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