Multi-layer circuit board bonding method utilizing noble metal c

Details Multi-layer circuit board bonding method utilizing noble metal c Multi-layer circuit board bonding method utilizing noble metal c

1985-03-13

1987-08-11

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 361414, H05K 336

Patent

active

046852107

ABSTRACT:
An electrically and mechanically sound conductive bond between layers of a multi-layer plated through hole circuit board is produced by depositing a layer of noble metal over the surfaces to be joined, juxtaposing the noble metal coated layers and subjecting them to a combination of pressure and heat for a sufficient period of time. Excellent results have been obtained in a multi-layer circuit board for a microstrip microwave antenna with 0.002 inch thick polished silver layers at bonding pressures of 490 to 575 psi and temperatures of 560 to 580 degrees F. for time periods of 20 to 30 minutes.

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