Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-10-04
1999-05-25
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 156 89, 427 97, H01K 310
Patent
active
059060425
ABSTRACT:
A micro filled material includes a binding material and optionally includes a number of particles. The binding material and the particles can be formed of any conductive or nonconductive material. Using such a micro filled via material, an electrical conductor is formed in a substrate for supporting one or more electronic components using the following steps: placing the micro filled via material between two conductive layers at various locations in a substrate at which an electrical conductor is to be formed; and optionally programming the micro filled via material to reduce the resistance of, or to form an electrical conductor.
REFERENCES:
patent: 3335327 (1967-08-01), Damon et al.
patent: 3384879 (1968-05-01), Stahl et al.
patent: 3615913 (1971-10-01), Shaw
patent: 3770529 (1973-11-01), Anderson
patent: 3808576 (1974-04-01), Castonguay et al.
patent: 3857683 (1974-12-01), Castonguay
patent: 3923359 (1975-12-01), Newsam
patent: 4024629 (1977-05-01), Lemoine et al.
patent: 4090667 (1978-05-01), Crimmins
patent: 4146863 (1979-03-01), Mollenhoff
patent: 4238839 (1980-12-01), Redfern et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4247981 (1981-02-01), Walters
patent: 4386051 (1983-05-01), Edgington
patent: 4399372 (1983-08-01), Tanimoto et al.
patent: 4413272 (1983-11-01), Mochizuki et al.
patent: 4420820 (1983-12-01), Preedy
patent: 4424578 (1984-01-01), Miyamoto
patent: 4433331 (1984-02-01), Kollaritsch
patent: 4434134 (1984-02-01), Darrow et al.
patent: 4455495 (1984-06-01), Masuhara et al.
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4488262 (1984-12-01), Basire et al.
patent: 4491860 (1985-01-01), Lim
patent: 4507756 (1985-03-01), McElroy
patent: 4507757 (1985-03-01), McElroy
patent: 4547830 (1985-10-01), Yamauchi
patent: 4562639 (1986-01-01), McElroy
patent: 4565712 (1986-01-01), Noguchi et al.
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4569120 (1986-02-01), Stacy et al.
patent: 4569121 (1986-02-01), Lim et al.
patent: 4585490 (1986-04-01), Raffel et al.
patent: 4590589 (1986-05-01), Gerzberg
patent: 4609241 (1986-09-01), Peterson
patent: 4642160 (1987-02-01), Burgess
patent: 4651409 (1987-03-01), Ellsworth et al.
patent: 4652974 (1987-03-01), Ryan
patent: 4678889 (1987-07-01), Yamanaka
patent: 4689411 (1987-08-01), Dick et al.
patent: 4700116 (1987-10-01), Inoue et al.
patent: 4700214 (1987-10-01), Johnson
patent: 4710592 (1987-12-01), Kimbara
patent: 4721868 (1988-01-01), Cornell et al.
patent: 4726991 (1988-02-01), Hyatt et al.
patent: 4731704 (1988-03-01), Lochner
patent: 4732780 (1988-03-01), Mituff et al.
patent: 4748490 (1988-05-01), Hollingsworth
patent: 4757359 (1988-07-01), Chiao et al.
patent: 4780670 (1988-10-01), Cherry
patent: 4786904 (1988-11-01), Graham, III et al.
patent: 4789760 (1988-12-01), Koyama et al.
patent: 4791075 (1988-12-01), Lin
patent: 4792646 (1988-12-01), Enomoto
patent: 4792835 (1988-12-01), Sacarisen et al.
patent: 4796074 (1989-01-01), Roesner
patent: 4796075 (1989-01-01), Whitten
patent: 4799128 (1989-01-01), Chen
patent: 4799984 (1989-01-01), Rellick
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4808967 (1989-02-01), Rice et al.
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4823181 (1989-04-01), Mohsen et al.
patent: 4829404 (1989-05-01), Jensen
patent: 4839864 (1989-06-01), Fujishima
patent: 4840924 (1989-06-01), Kinbara
patent: 4841099 (1989-06-01), Epstein et al.
patent: 4845315 (1989-07-01), Stopper
patent: 4847732 (1989-07-01), Stopper
patent: 4864165 (1989-09-01), Hoberman et al.
patent: 4873506 (1989-10-01), Gurevich
patent: 4874711 (1989-10-01), Hughes et al.
patent: 4876220 (1989-10-01), Mohsen et al.
patent: 4881114 (1989-11-01), Mohsen et al.
patent: 4882611 (1989-11-01), Blech et al.
patent: 4888574 (1989-12-01), Rice et al.
patent: 4888665 (1989-12-01), Smith
patent: 4892776 (1990-01-01), Rice
patent: 4893167 (1990-01-01), Boudou et al.
patent: 4897836 (1990-01-01), Fitzpatrick et al.
patent: 4899205 (1990-02-01), Hamdy et al.
patent: 4910418 (1990-03-01), Graham et al.
patent: 4914055 (1990-04-01), Gordon et al.
patent: 4915983 (1990-04-01), Lake et al.
patent: 4916809 (1990-04-01), Boudou et al.
patent: 4920454 (1990-04-01), Stopper et al.
patent: 4924287 (1990-05-01), Orbach
patent: 4933738 (1990-06-01), Orbach et al.
patent: 4935584 (1990-06-01), Boggs
patent: 4937475 (1990-06-01), Rhodes et al.
patent: 4943538 (1990-07-01), Mohsen et al.
patent: 4949084 (1990-08-01), Schwartz et al.
patent: 4964948 (1990-10-01), Reed
patent: 4969124 (1990-11-01), Luich et al.
patent: 4974048 (1990-11-01), Chakravorty et al.
patent: 4977357 (1990-12-01), Shrier
patent: 4992333 (1991-02-01), Hyatt
patent: 5003486 (1991-03-01), Hendel et al.
patent: 5014002 (1991-05-01), Wiscombe et al.
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5030113 (1991-07-01), Wilson
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5055973 (1991-10-01), Mohsen
patent: 5060116 (1991-10-01), Grobman et al.
patent: 5068634 (1991-11-01), Shrier
patent: 5077451 (1991-12-01), Mohsen
patent: 5087589 (1992-02-01), Chapman et al.
patent: 5092032 (1992-03-01), Murakami
patent: 5097593 (1992-03-01), Jones et al.
patent: 5099149 (1992-03-01), Smith
patent: 5099380 (1992-03-01), Childers et al.
patent: 5106773 (1992-04-01), Chen et al.
patent: 5120679 (1992-06-01), Boardman et al.
patent: 5142263 (1992-08-01), Childers et al.
patent: 5144567 (1992-09-01), Oelsch et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148355 (1992-09-01), Lowe et al.
patent: 5155577 (1992-10-01), Chance et al.
patent: 5166556 (1992-11-01), Hsu et al.
patent: 5181096 (1993-01-01), Forouhi
patent: 5181859 (1993-01-01), Foreman et al.
patent: 5189387 (1993-02-01), Childers et al.
patent: 5196724 (1993-03-01), Gordon et al.
patent: 5200652 (1993-04-01), Lee
patent: 5210940 (1993-05-01), Kawakami et al.
patent: 5218679 (1993-06-01), Hasegawa et al.
patent: 5220490 (1993-06-01), Weigler et al.
patent: 5229549 (1993-07-01), Yamakawa et al.
patent: 5233217 (1993-08-01), Dixit et al.
patent: 5248517 (1993-09-01), Shrier et al.
patent: 5250228 (1993-10-01), Baigrie et al.
patent: 5250470 (1993-10-01), Yamaguchi
patent: 5258643 (1993-11-01), Cohen
patent: 5260519 (1993-11-01), Knickerbocker et al.
patent: 5260848 (1993-11-01), Childers
patent: 5262754 (1993-11-01), Collins
patent: 5264729 (1993-11-01), Rostoker et al.
patent: 5282271 (1994-01-01), Hsieh et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5287620 (1994-02-01), Suzuki et al.
patent: 5300208 (1994-04-01), Angelopoulos et al.
patent: 5311053 (1994-05-01), Law et al.
patent: 5317801 (1994-06-01), Tanaka et al.
patent: 5319238 (1994-06-01), Gordon et al.
patent: 5321322 (1994-06-01), Verheyen et al.
patent: 5329153 (1994-07-01), Dixit
patent: 5346750 (1994-09-01), Hatakeyama et al.
patent: 5347258 (1994-09-01), Howard et al.
patent: 5349248 (1994-09-01), Parlour et al.
patent: 5362676 (1994-11-01), Gordon et al.
patent: 5367764 (1994-11-01), DiStefano et al.
patent: 5377124 (1994-12-01), Mohsen
patent: 5397921 (1995-03-01), Karnezos
patent: 5404637 (1995-04-01), Kawakami
patent: 5409865 (1995-04-01), Karnezos
patent: 5410806 (1995-05-01), Schneider
patent: 5420456 (1995-05-01), Galbi et al.
patent: 5420460 (1995-05-01), Massingill
patent: 5435480 (1995-07-01), Hart et al.
patent: 5438166 (1995-08-01), Carey et al.
patent: 5464790 (1995-11-01), Hawley
patent: 5481795 (1996-01-01), Hatakeyama et al.
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5502889 (1996-04-01), Casson et al.
patent: 5537108 (1996-07-01), Nathan et al.
patent: 5572409 (1996-11-01), Nathan et al.
"A Large Format Modified TEA CO.sub.2 Laser Based Process for Cost Effective Small Via Generation", J.M. Morrison, etc., MCM '94 Proceedings, pp. 369-377.
"The Application of Laser Process Technology to Thin Film Packaging", T.F. Redmond, etc., IEEE 1992, pp. 1066-1071.
"Rigid-Flex: The Old and The New", Jahn Stopperan, Sheldahl, Inc., 4 pages.
"A New Circuit Substrate For MCM-L", Yusuke Wada, ICEMCM, 1995, pp. 59-64.
"Matsushita Team Eliminates Holes in High-Density PCB", Kenji Tsuda, Tokyo, Nikkei Elec
Chiang Steve S.
Lan James J. D.
Shepherd William H.
Wu Paul Y. F.
Xie John Y.
Arbes Carl J.
MacPherson Alan H.
Prolinx Labs Corporation
Suryadevara Omkar K.
LandOfFree
Method and structure to interconnect traces of two conductive la does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and structure to interconnect traces of two conductive la, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and structure to interconnect traces of two conductive la will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-395554