Process condition sensing wafer and data analysis system

Details Process condition sensing wafer and data analysis system Process condition sensing wafer and data analysis system

2008-04-22

2008-04-22

Williams, Hezron (Department: 2856)

Measuring and testing

Instrument mechanism or transmission

C073S866000, C073S865900, C438S017000

Reexamination Certificate

active

10685550

ABSTRACT:
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.

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