Method to manufacture a coreless packaging substrate

Details Method to manufacture a coreless packaging substrate Method to manufacture a coreless packaging substrate

2008-09-02

2008-09-02

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C438S618000, C257SE23145

Reexamination Certificate

active

11599983

ABSTRACT:
A method of manufacturing a coreless packaging substrate is disclosed. The method can produce a coreless packaging substrate which comprises: at least a built-up structure having a first solder mask and a second solder mask, wherein a plurality of openings are formed in the first and second solder mask to expose the conductive pads of the built-up structure; and a plurality of solder bumps as well as solder layers formed on the conductive pads. Therefore, the invention can produce the coreless packaging substrate with high density of circuit layout, less manufacturing steps, and small size.

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