Interconnect for bumped semiconductor components

Details Interconnect for bumped semiconductor components Interconnect for bumped semiconductor components

2008-01-08

2008-01-08

Hollington, Jermele (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11243702

ABSTRACT:
An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a pattern of leads cantilevered over the recess configured to electrically engage a bumped contact. The leads are adapted to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the leads can include projections for penetrating the bumped contacts, a non-bonding outer layer for preventing bonding to the bumped contacts, and a curved shape which matches a topography of the bumped contacts. The leads can be formed by forming a patterned metal layer on the substrate, by attaching a polymer substrate with the leads thereon to the substrate, or be etching the substrate to form conductive beams.

REFERENCES:
patent: 4067104 (1978-01-01), Tracy
patent: 4686468 (1987-08-01), Lee et al.
patent: 4766666 (1988-08-01), Sugiyama et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4989069 (1991-01-01), Hawkins
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5042148 (1991-08-01), Tada et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5137461 (1992-08-01), Bindra et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5196726 (1993-03-01), Nishiguichi et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5481205 (1996-01-01), Frye et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5487999 (1996-01-01), Farnworth
patent: 5495179 (1996-02-01), Wood et al.
patent: 5500605 (1996-03-01), Chang
patent: 5519332 (1996-05-01), Wood et al.
patent: 5525545 (1996-06-01), Grube et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5559444 (1996-09-01), Farnworth
patent: 5572140 (1996-11-01), Lim et al.
patent: 5592736 (1997-01-01), Akram et al.
patent: 5607818 (1997-03-01), Akram et al.
patent: 5615824 (1997-04-01), Fjelstad
patent: 5625298 (1997-04-01), Hirano et al.
patent: 5629837 (1997-05-01), Barabi et al.
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5634267 (1997-06-01), Farnworth et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5678301 (1997-10-01), Gochnour et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5691649 (1997-11-01), Farnworth et al.
patent: 5716218 (1998-02-01), Farnworth et al.
patent: 5756370 (1998-05-01), Farnworth et al.
patent: 5783461 (1998-07-01), Hembree
patent: 5789271 (1998-08-01), Akram
patent: 5789278 (1998-08-01), Akram et al.
patent: 5796264 (1998-08-01), Farnworth et al.
patent: 5801452 (1998-09-01), Farnworth et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5834366 (1998-11-01), Akram
patent: 5834945 (1998-11-01), Akram et al.
patent: 5869974 (1999-02-01), Akram et al.
patent: 5900674 (1999-05-01), Wojnarowski et al.
patent: 5931685 (1999-08-01), Hembree et al.
patent: 5936847 (1999-08-01), Kazle
patent: 5962921 (1999-10-01), Farnworth et al.
patent: 5973394 (1999-10-01), Slocum et al.
patent: 5985682 (1999-11-01), Higgins, III
patent: 6005288 (1999-12-01), Farnworth et al.
patent: 6016060 (2000-01-01), Akram et al.
patent: 6037667 (2000-03-01), Hembree et al.
patent: 6040702 (2000-03-01), Hembree et al.
patent: 6072326 (2000-06-01), Akram et al.
patent: 6086386 (2000-07-01), Fjelstad et al.
patent: 6091252 (2000-07-01), Akram et al.
patent: 6094988 (2000-08-01), Aindow
patent: 6107109 (2000-08-01), Akram et al.
patent: 6114864 (2000-09-01), Soejima et al.
patent: 6188301 (2001-02-01), Kornrumpf et al.
patent: 6200143 (2001-03-01), Haba et al.
patent: 6208156 (2001-03-01), Hembree
patent: 6208157 (2001-03-01), Akram et al.
patent: 6222280 (2001-04-01), Farnworth et al.
patent: 6232243 (2001-05-01), Farnworth et al.
patent: 6242932 (2001-06-01), Hembree
patent: 6242935 (2001-06-01), Akram
patent: 6246249 (2001-06-01), Fukasawa et al.
patent: 6294837 (2001-09-01), Akram et al.
patent: 6310484 (2001-10-01), Akram et al.
patent: 6313651 (2001-11-01), Hembree
patent: 6314641 (2001-11-01), Akram
patent: 6337577 (2002-01-01), Doherty
patent: 6406774 (2002-06-01), Banba et al.
patent: 6414506 (2002-07-01), Akram et al.
patent: 6437591 (2002-08-01), Farnworth
patent: 6498503 (2002-12-01), Akram et al.
patent: 6529026 (2003-03-01), Farnworth et al.
patent: 6661247 (2003-12-01), Maruyama et al.
patent: 6835898 (2004-12-01), Eldridge et al.
patent: 6980017 (2005-12-01), Farnworth et al.
patent: 7002362 (2006-02-01), Farnworth et al.
patent: 7043831 (2006-05-01), Farnworth et al.
patent: 7225538 (2007-06-01), Eldridge et al.
patent: 08050146 (1996-02-01), None
“Technical Report, Shin-Etsu Inter Connector, MT-Type”, Shin-Etsu Polymer America, Inc., No. MT-TYPE US, pp. 1-4 and title page, Aug. 1998.
Information displayed at Chip Con 1997-1998, 4 sheets, on FE CRD Floating Point Technology, month unavailable.

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