Printed wiring board with a plurality of pads and a...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge

Reexamination Certificate

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Details

C439S055000

Reexamination Certificate

active

11585959

ABSTRACT:
A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.

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patent: 2004/0144562 (2004-07-01), Ishikawa
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patent: 2007/0012475 (2007-01-01), Kawaguchi et al.
patent: 06-168297 (1994-06-01), None
patent: 09-097957 (1997-04-01), None
patent: 2002-009511 (2002-01-01), None
patent: 2003-282768 (2003-10-01), None
patent: 2004-228478 (2004-08-01), None

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