Method of fabricating a semiconductor integrated circuit...

Details Method of fabricating a semiconductor integrated circuit... Method of fabricating a semiconductor integrated circuit...

2008-04-22

2008-04-22

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S125000, C438S946000, C257SE21511, C430S005000, C430S313000

Reexamination Certificate

active

11714837

ABSTRACT:
Productivity of a semiconductor integrated circuit device is improved. According to how many times the photomask is used, a photomask having an opaque pattern made of metal and a photomask having an opaque pattern made of a resist film are properly used, and thereby an exposure treatment is performed.

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International Search Reported dated Oct. 15, 2001 for PCT/JP01/07035.
International Preliminary Examination Report dated Apr. 19, 2002 for PCT/JP01/07035.
Chinese Office Action dated Nov. 18, 2005.

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