Stacked chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257S723000, C257S784000, C257SE25030, C257SE23011

Reexamination Certificate

active

10994243

ABSTRACT:
A stacked chip semiconductor device whose size is substantially reduced by high density packaging of two or more semiconductor chips. In the semiconductor device, four semiconductor chips are stacked over a printed wiring board. The bottom semiconductor chip has an interface circuit which includes a buffer and an electrostatic discharge protection circuit. All signals that these semiconductor chips receive and send are inputted or outputted through the interface circuit of the bottom semiconductor chip. Since the other semiconductor chips require no interface circuit, the semiconductor device is compact.

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