Aqueous cleaner with low metal etch rate comprising...

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

Reexamination Certificate

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Details

C510S175000, C510S176000, C510S181000, C510S504000

Reexamination Certificate

active

11094113

ABSTRACT:
A cleaning solution is provided for cleaning metal-containing microelectronic substrates, particularly for post etch, via formation and post CMP cleaning. The cleaning solution consists of a quaternary ammonium hydroxide, an organic amine, and water. A preferred cleaning solution consists of tetramethylammonium hydroxide, monoethanolamine, and water. The pH of cleaning solution is greater than 10.

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Int'l Search Report for PCT/US2006/007676 dated Jul. 12, 2006.

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