Flextensional transducer and method of forming flextensional...

Etching a substrate: processes – Forming or treating thermal ink jet article

Reexamination Certificate

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C029S890100, C438S021000

Reexamination Certificate

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11041773

ABSTRACT:
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.

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