Heat dissipation structure for electronic device

Details Heat dissipation structure for electronic device Heat dissipation structure for electronic device

2008-04-15

2008-04-15

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S712000, C257S717000, C257S720000, C257S729000, C257SE23103, C361S709000, C361S710000, C438S122000

Reexamination Certificate

active

11062708

ABSTRACT:
A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering members, and a portion of the heat dissipation frame is exposed outside of the electronic device.

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