Semiconductor encapsulant of epoxy resin, phenolic resin and...

Details Semiconductor encapsulant of epoxy resin, phenolic resin and... Semiconductor encapsulant of epoxy resin, phenolic resin and...

2008-04-08

2008-04-08

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C523S457000, C523S466000, C525S507000

Reexamination Certificate

active

10968208

ABSTRACT:
One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin, (B) a phenolic resin, (C) a hardening accelerator, (D) an inorganic filler and (E) a triazole compound, preferably an epoxy resin composition for encapsulating a semiconductor wherein the triazole compound is a compound represented by general formula (1):wherein R1 represents hydrogen atom, or mercapto group, amino group, hydroxyl group or a hydrocarbon chain with 1 to 8 carbon atoms containing one or more of the functional groups as an end group.

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Patent Abstracts of Japan, Derwent and CAPLUS abstracts for Japanese Patent No. 62-161820 A, Hitachi Chem. Co. Ltd., Jul. 17, 1987, six pages.

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