High density memory card assembly

Details High density memory card assembly High density memory card assembly

2008-01-08

2008-01-08

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE25023, C257S685000, C257S686000, C257S777000, C361S761000, C361S764000, C174S260000, C365S232000

Reexamination Certificate

active

10952891

ABSTRACT:
A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate. First and second digital memory devices (e.g., TSOP packages or bare semiconductor dies) are located within the cavity so as to be recessed relative to the top and bottom of the substrate. The recessed first and second memory devices are arranged in spaced, face-to-face alignment with one another within the cavity. The first and second memory devices are covered and protected by respective first and second memory packages that are located on the top and bottom of the substrate. By virtue of the foregoing, the memory package density of the assembly can be increased without increasing the height or area consumed by the assembly for receipt within an existing external housing.

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