Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-05-27
2008-05-27
Dinh, Tuan T. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S257000, C174S258000
Reexamination Certificate
active
10782640
ABSTRACT:
A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A signal path layer is interposed between the first dielectric material and the second dielectric material. An adhesive layer is interposed between the first dielectric material and the second dielectric material such that the adhesive layer is substantially coplanar relative to the signal path layer.
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Bois Karl Joseph
Michalka Timothy L.
Dinh Tuan T.
Hewlett--Packard Development Company, L.P.
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