Method and system for integrated circuit packaging

Details Method and system for integrated circuit packaging Method and system for integrated circuit packaging

2008-07-22

2008-07-22

Lee, Edmund H. (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S272170, C264S338000

Reexamination Certificate

active

11142204

ABSTRACT:
According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfaces form the upper and lower surfaces of a mold cavity when the first and second mold press die are engaged. The mold tool also includes a bright TiN coating disposed on the first non-planar surface. The bright TiN coating operates to decrease residue on the first non-planar surface from a mold compound. The mold compound is distributed into the mold cavity to form a package operable to encapsulate an integrated circuit

REFERENCES:
patent: 5800747 (1998-09-01), Cavasin
patent: 6033218 (2000-03-01), Bergstrom et al.
patent: 3-254910 (1991-11-01), None

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