Test pattern and method of evaluating the transfer...

Details Test pattern and method of evaluating the transfer... Test pattern and method of evaluating the transfer...

2008-04-08

2008-04-08

Young, Christopher G. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C382S144000, C382S145000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

11713962

ABSTRACT:
A test pattern or set of patterns, a method of evaluating the transfer properties of the pattern, and a method of determining a parameter of a transfer process (e.g., imaging process) making use of the test pattern is provided. With the test pattern, the impact of line edge roughness on a transferred pattern may be analyzed. For example, the test pattern may be based upon a lines/spaces pattern, wherein periodic structures having a well-defined period and amplitude are adjacent to the lines. A photomask is provided with the test pattern and an image of the pattern is obtained. Edges of the image are determined and, therefrom, a set of edge position data are obtained. Edge position data are fitted to a straight line to determine edge position residuals. An amplitude spectrum is calculated dependent upon spatial frequencies to obtain a amplitude/spatial frequency relationship. A ratio of determined maximum is formed.

REFERENCES:
patent: 2003 262 947 (2003-09-01), None
patent: WO 2005/059531 (2005-06-01), None
B.D. Bunday et al. “CD-SEM measurement of line edge roughness test patterns for 193 nm lithography”, Proceeding of the SPIE, vol. 5041 (Jul. 2003), pp. 127-141.

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