Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2008-01-29

2008-01-29

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S031000, C700S105000, C438S014000

Reexamination Certificate

active

11305074

ABSTRACT:
A method for manufacturing a semiconductor device is provided in which it is possible to perform process control taking account of wafer information and to deal with the process control in which a recipe is change from one wafer to another. The method comprises steps of inserting a process control system into the path of a network where a manufacturing execution system (MES) and a manufacturing apparatus are connected with each other by using a LAN, obtaining a process result on the lot of the wafers at a previous step through the use of the process control system to rewrite the process recipe, and transmitting the rewritten process recipe from the process control system to the manufacturing apparatus. Since the method includes the step of obtaining the process result on the lot effected at the previous step as wafer information, it is possible to calculate a control parameter taking account of the state of the wafers. Also, since a process control (APC) system is inserted between the MES and the apparatus, there is no communication between the MES and the APC system, so that a communication burden is reduced, thereby the process control can be performed from one wafer to another.

REFERENCES:
patent: 2007/0026541 (2007-02-01), Kokura
patent: 2002009059 (2002-01-01), None

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