Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate
Reexamination Certificate
2008-04-01
2008-04-01
Sellers, Robert (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From phenol, phenol ether, or inorganic phenolate
C525S523000, C528S094000, C528S120000
Reexamination Certificate
active
11241258
ABSTRACT:
A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the chip-packaging composition. A method includes assembly of the chip-packaging composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the chip-packaging composition.
REFERENCES:
patent: 4013747 (1977-03-01), Hampel
patent: 4321354 (1982-03-01), Kluger et al.
patent: 4874548 (1989-10-01), Hajovsky
patent: 5025078 (1991-06-01), Lucas et al.
patent: 5252631 (1993-10-01), Owens
patent: 5258426 (1993-11-01), Uchida et al.
patent: 5508373 (1996-04-01), Shah et al.
patent: 6642344 (2003-11-01), House et al.
patent: 7141629 (2006-11-01), Chow et al.
patent: 2007/0152311 (2007-07-01), Jayaraman et al.
patent: 860486 (1998-08-01), None
patent: WO 98/28379 (1998-07-01), None
Chemical abstracts registry No. 6864-37-5 for 3,3'-dimethyl-4,4'-dimainocyclohexylamine, or Ancamine 2049, 1967, one page.
Arduengo, III, A. J., et al., “An Air Stable Carbene and Mixed Carbene “Dimers””,J. Am. Chem. Soc., vol. 119(52), (1997), 12742-12749.
Arduengo, III, A. J., “Looking for Stable Carbenes: The Difficulty in Starting Anew”,Accounts of Chemical Research, 32(11), (Nov. 1999), 913-921.
Trnka, T. M., et al., “Synthesis and Activity of Ruthenium Alkylidene Complexes Coordinated with Phosphine and N-Heterocyclic Carbene Ligands”,J. Am. Chem. Soc., 125(9), (2003), 2546-2554.
Intel Corporation
Schwegman Lundberg & Woessner, P.A.
Sellers Robert
LandOfFree
Chip-packaging composition of resin and cycloaliphatic amine... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip-packaging composition of resin and cycloaliphatic amine..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip-packaging composition of resin and cycloaliphatic amine... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3917565