Method for fabricating a transformer integrated with a...

Details Method for fabricating a transformer integrated with a... Method for fabricating a transformer integrated with a...

2008-01-22

2008-01-22

Nguyen, Tuyen T. (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

Reexamination Certificate

active

11736565

ABSTRACT:
A substrate is provided and a top interconnection metal layer and a primary winding layer are formed thereon. Then a passivation layer having a plurality of via exposed parts of the top interconnection metal layer is formed on the substrate. A secondary winding layer and at least a bonding pad are formed on the passivation layer. The bonding pad electrically connects to the top interconnection metal layer through the via.

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