Method of removing lead-free solder from slider pad and...

Details Method of removing lead-free solder from slider pad and... Method of removing lead-free solder from slider pad and...

2008-03-11

2008-03-11

Chen, Tianjie (Department: 2627)

Dynamic magnetic information storage or retrieval

Head mounting

Disk record

C360S235400, C360S264200

Reexamination Certificate

active

11179219

ABSTRACT:
A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.

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