Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-07-29
2008-07-29
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S779000, C257SE23015
Reexamination Certificate
active
11224108
ABSTRACT:
A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer3is formed on a supporting board2so that insulating concave portions13are formed at portions thereof where external connecting terminals8are to be formed. A conductive pattern4is formed on the insulating base layer3so that a number of lines of wire4a,4b,4c,4d,the magnetic head connecting terminals7,and the external connecting portions8are integrally formed, and conductive concave portions9are formed in the external connecting terminals8.Thereafter, an insulating cover layer10is formed on the insulating base layer3so that the magnetic head connecting terminals7and the external connecting terminals8are exposed from the insulating cover layer10.In the suspension board with circuit1thus formed, when the external connecting terminals8are connected with connecting terminals of a read/write substrate via the solder balls21,reliable connection therebetween can be ensured.
REFERENCES:
patent: 5376584 (1994-12-01), Agarwala
patent: 6323542 (2001-11-01), Hashimoto
patent: 2002/0007961 (2002-01-01), Yamato et al.
patent: 2002/0187585 (2002-12-01), Tsukada et al.
patent: HEI. 11-266066 (1999-09-01), None
Kanagawa Hitoki
Ohsawa Tetsuya
Ooyabu Yasunari
Akerman & Senterfitt
Edwards, Esq. Jean C.
Nitto Denko Corporation
Trinh Hoa B
Weiss Howard
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