Method of manufacturing optical semiconductor device,...

Details Method of manufacturing optical semiconductor device,... Method of manufacturing optical semiconductor device,...

2008-07-01

2008-07-01

Malsawma, Lex (Department: 2892)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

11072233

ABSTRACT:
A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.

REFERENCES:
patent: 3283045 (1966-11-01), Thiel
patent: 3764862 (1973-10-01), Jankowski
patent: 2006/0151924 (2006-07-01), Iwasaki et al.
patent: 7-183440 (1995-07-01), None
patent: 07183440 (1995-07-01), None
patent: 2003266530 (2003-09-01), None

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