Low profile thermosiphon

Details Low profile thermosiphon Low profile thermosiphon

2008-09-09

2008-09-09

Walberg, Teresa J (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S104210, C165S104330, C361S700000

Reexamination Certificate

active

11407452

ABSTRACT:
A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is disposed within one or more boiling chambers. Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top. The condenser tubes receive and condense vapor boiled off from the refrigerant. Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.

REFERENCES:
patent: 4027728 (1977-06-01), Kobayashi et al.
patent: 5168919 (1992-12-01), Berenholz et al.
patent: 5613552 (1997-03-01), Osakabe et al.
patent: 5823248 (1998-10-01), Kadota et al.
patent: 6005772 (1999-12-01), Terao et al.
patent: 6076596 (2000-06-01), Osakabe et al.
patent: 6119767 (2000-09-01), Kadota et al.
patent: 6341646 (2002-01-01), Tanaka et al.
patent: 6588498 (2003-07-01), Reyzin et al.
patent: 6834713 (2004-12-01), Ghosh et al.
patent: 6935409 (2005-08-01), Parish, IV et al.

Affiliated with

Also associated with

Rating

Low profile thermosiphon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low profile thermosiphon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile thermosiphon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3906625