Method for forming ceramic thick film element arrays with...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C264S297600

Reexamination Certificate

active

11017569

ABSTRACT:
A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.

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Partial European Search Report
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