Low EMI capacitive trackpad

Details Low EMI capacitive trackpad Low EMI capacitive trackpad

2008-07-01

2008-07-01

Shalwala, Bipin (Department: 2629)

Computer graphics processing and selective visual display system

Display peripheral interface input device

Touch panel

C345S156000, C345S174000, C178S018060, C178S019040, C341S033000, C361S600000, C361S736000, C361S761000

Reexamination Certificate

active

10948937

ABSTRACT:
A printed circuit board (PCB) assembly provides a two layer capacitive trackpad sensor in which an EMI ground grid is interposed among the sensor's capacitive elements on each of its layers. The EMI grid on each of the two layers is electrically coupled via, typically, vias. The described arrangement of sensor elements (capacitor plates) and EMI ground grid traces may be incorporated into a PCB having additional layers (e.g., a four, six or eight layer PCB). If used in this manner, additional vias are provided on the PCB which permit electrical coupling between these “additional layers” and which are electrically isolated from, and shielded by, the EMI ground grid.

REFERENCES:
patent: 5767457 (1998-06-01), Gerpheide et al.
patent: 5869790 (1999-02-01), Shigetaka et al.
patent: 5926171 (1999-07-01), Matsufusa et al.
patent: 6188391 (2001-02-01), Seely et al.
patent: 6242997 (2001-06-01), Barrett et al.
patent: 6762498 (2004-07-01), Morrison et al.
patent: 2004/0041185 (2004-03-01), Ireland
US Patent Application entitled Hybrid Ground Grid for Printed Circuit Board by Robert Steinfeld and Cheung-Wei Lam. U.S. Appl. No. 10/774,053, filed Feb. 5, 2004.

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