Cryogenic cooling of circuit boards

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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174 154, 357 81, 357 82, 357 83, 361386, 361388, H05K 720

Patent

active

051424436

ABSTRACT:
A mounting arrangement for electronic circuit chips in which at least one chip is mounted upon an appropriately electrically insulating chip plate. A connector board is mounted on top of the chip plate to electrically connect the chip with a cable allowing signals to be passed to and from the chip. The chip plate is mounted for good thermal conductivity to a refrigerator cold head. A plate formed of a material with good heat conductitivity properties may be interposed between the chip plate and the cold head. This plate may include an element, such as a spring biased piston, which contacts the chip to allow heat transfer by conduction. The refrigerator cold head forms the upper surface of the expansion space in a Stirling-cycle cryogenic cooling engine. To reduce power requirements, the elements are insulated from contact with the atmosphere. Specifically, the elements are enclosed in a vessel which includes a double walled hood having insulating material and a high vacuum between the double walls to reduce heat transfer. Additionally, bulk insulation may be placed around the refrigerator cold head and aluminum plate within the confines of the hood. Finally, sealing means are provided at the bottom of the hood to seal the interior of the vessel, thus further reducing heat transfer.

REFERENCES:
patent: 4531146 (1985-07-01), Cutchaw
patent: 4879629 (1989-11-01), Tustaniwskyj et al.
patent: 4879632 (1989-11-01), Yamamoto et al.
Chu et al., "Conduction Cooling for an LSI Package: A One-Dimensional Approach", Jan. 1982, pp. 45-54.
Oktay, S., et al., "High Heat From a Small Package", Mechanical Engineering, Mar. 1986, vol. 108 No. 3, pp. 36-42.

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