Stacked die-in-die BGA package with die having a recess

Details Stacked die-in-die BGA package with die having a recess Stacked die-in-die BGA package with die having a recess

2007-10-16

2007-10-16

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S125000, C257S724000, C257S777000, C257S783000

Reexamination Certificate

active

11440913

ABSTRACT:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided. In an embodiment of the methods, a second die is mounted on a first die which is at least partially received within a recess of the second die and an overall height of the dies within the device is less than a combined height of the dies.

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IBM Research Disclosure RD41388 (N.N.), Sep. 1, 1998.

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