Method of sealing an array of cell microstructures using...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S292000, C156S273700, C156S275700

Reexamination Certificate

active

10739621

ABSTRACT:
A method for sealing microstructured cells, which are defined by at least a first substrate and a wall microstructure extending from the first substrate, includes a step of applying a plurality of adhesive microcapsules along at least one of a first side of a second substrate and an exposed end portion of the wall microstructure. The adhesive microcapsules containing an adhesive substance. Another step includes positioning the first side of the second substrate adjacent the end portion of the wall microstructure. Still another step includes rupturing at least a portion of the plurality of adhesive microcapsules dispensing the adhesive substance between the end portion of the wall microstructure and the first side of the second substrate. A microstructure is also provided.

REFERENCES:
patent: 7037024 (2006-05-01), Steinwender
patent: 2002/0008898 (2002-01-01), Katase
patent: 2003/0035885 (2003-02-01), Zang et al.
patent: 2005/0128582 (2005-06-01), Gibilini
patent: WO 01/67170 (2001-09-01), None
patent: WO 02/01281 (2002-01-01), None
Durant, Yvon G., PhD, MBA, “Microcapsule Morphology in Microencapsulation Processes, Fundamental Chemical Differences”; PowerPoint presentation, University of New Hampshire; Jul. 22, 2002, pp. 1-28.
Homola, J., “Color-Changing Inks, Brighten your bottom line”; Color Change Corp. for Screen Printing Magazine; http:// www.screenweb.com/inks/cont/brighten981119.html; Dec. 15, 2003, pp. 1-5.
“AVEKA Novel Processing Technologies . . . ”; Aveka Group-Particle Processing And Custom Research; http://www.thomasregister.com/olc/73439614/about4.htm; Dec. 15, 2003, pp. 1-2.

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