Process for producing electro-optic hybrid circuit board

Details Process for producing electro-optic hybrid circuit board Process for producing electro-optic hybrid circuit board

2007-10-23

2007-10-23

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S852000, C385S002000

Reexamination Certificate

active

11285358

ABSTRACT:
The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer sheet that comprises a releasable substrate and a metal foil formed thereon; forming a core layer on the undercladding layer; forming an overcladding layer so as to cover the core layer and the undercladding layer; stripping the releasable substrate from the metal foil; and etching the metal foil to thereby form a predetermined conductor pattern.

REFERENCES:
patent: 7212700 (2007-05-01), Naitou et al.
patent: 2004/0047539 (2004-03-01), Okubora et al.
patent: 2004/0057688 (2004-03-01), Akutsu et al.
patent: 1 041 418 (2000-10-01), None
patent: 1 369 255 (2003-12-01), None
patent: 1 512 996 (2005-03-01), None
patent: 2002-236228 (2002-08-01), None
patent: WO 2004/060033 (2004-07-01), None
European Office Action dated Jul. 20, 2007.

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