Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2007-08-21
2007-08-21
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C257SE21310
Reexamination Certificate
active
11026937
ABSTRACT:
A method of fabricating the gate spacers of semiconductor devices is disclosed. An example method forms a gate on a semiconductor substrate, deposits a buffer oxide layer and a nitride layer sequentially on the whole semiconductor substrate including the gate, and forms spacers by etching the nitride layer.
REFERENCES:
patent: 5953615 (1999-09-01), Yu
patent: 6015747 (2000-01-01), Lopatin et al.
patent: 6194279 (2001-02-01), Chen et al.
patent: 6207544 (2001-03-01), Nguyen et al.
patent: 6277700 (2001-08-01), Yu et al.
patent: 2002/0003126 (2002-01-01), Kumar et al.
patent: 2004/0089632 (2004-05-01), Park et al.
patent: 2005/0277250 (2005-12-01), Pan et al.
patent: 2005/0284576 (2005-12-01), America et al.
Coleman W. David
Dongbu Electronics Co. Ltd.
Saliwanchik Lloyd & Saliwanchik
LandOfFree
Methods of fabricating gate spacers for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of fabricating gate spacers for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of fabricating gate spacers for semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3900537