Method for testing a chip with a package and for mounting...

Details Method for testing a chip with a package and for mounting... Method for testing a chip with a package and for mounting...

2007-10-23

2007-10-23

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S837000, C029S874000, C029S882000, C029S884000

Reexamination Certificate

active

11130709

ABSTRACT:
A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted into a socket for testing. Before mounting on the board, at least one connecting pin, preferably every second connecting pin, of the package is bent inward by a bending tool to achieve an offset arrangement of the connecting pins. The package is preferably mounted on the board using the bending tool. Since every second connecting pin is not bent inward immediately before insertion of the connecting pins, no subsequent corrective alignment of the offset connecting pins is required.

REFERENCES:
patent: 3441853 (1969-04-01), Bodine
patent: 3550238 (1970-12-01), Allen et al.
patent: 3564691 (1971-02-01), Ackerman
patent: 3573617 (1971-04-01), Randolph et al.
patent: 3688393 (1972-09-01), Halstead
patent: 3701077 (1972-10-01), Kelly, Jr.
patent: 4293998 (1981-10-01), Kawa et al.
patent: 4367584 (1983-01-01), Janisiewicz et al.
patent: 4498047 (1985-02-01), Hexamer et al.

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