Device for testing thin elements

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S750010, C324S754090, C324S765010

Reexamination Certificate

active

11314624

ABSTRACT:
A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.

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patent: 6515494 (2003-02-01), Low
patent: 6559670 (2003-05-01), Motamedi
patent: 7022985 (2006-04-01), Knebel et al.
patent: 7034563 (2006-04-01), Souchkov et al.
patent: 2005/0122125 (2005-06-01), Dunklee et al.

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