Method of mounting terminal on printed board, terminal...

Details Method of mounting terminal on printed board, terminal... Method of mounting terminal on printed board, terminal...

2007-12-25

2007-12-25

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S260000, C228S261000

Reexamination Certificate

active

11206181

ABSTRACT:
A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowing nozzles solders soldered portion of the first terminal groups to a first conductor on a back side of the printed board, then the printed board is turned upside down to put the second terminal groups in an upward facing state and to use a jig to shield the first terminal groups facing downward, and solder jetted from the solder blowing nozzles solders soldered portion of the second terminal groups to a second conductor on a front side of the printed board.

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