Integrated circuit package with air gap

Details Integrated circuit package with air gap Integrated circuit package with air gap

2007-08-07

2007-08-07

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S704000, C438S329000

Reexamination Certificate

active

11487077

ABSTRACT:
An integrated circuit (IC) package comprises an IC wafer comprising a circuit. A “C”-shaped layer is arranged adjacent to the substrate and that creates an air gap between the “C”-shaped layer and the circuit of the IC wafer.

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