Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-12-11
2007-12-11
Koch, George (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S358000, C156S360000, C156S378000
Reexamination Certificate
active
11467253
ABSTRACT:
A mounting device and a method thereof for preventing a pellet from cracking or chipping when the pellet is mounted. A mounting device comprises a first head for mounting a second pellet on a first pellet already mounted and temporarily pressure-bonding the second pellet thereto by applying a first load and a second head for pressure-bonding the second pellet, which has been temporarily pressure-bonded by the first head, to the first pellet by applying a second load higher than the first load. The second head includes a protective sheet which is moved so that the unused portion is set with respect to each pellet, a ball which is supported rollably in arbitrary directions and in contact with the second pellet through the protective sheet, a spring for applying an elastic force in the direction of the protective sheet and applying the second load to the second pellet through the protective sheet, and a drive for rolling the ball on the protective sheet in contact with the second pellet.
REFERENCES:
patent: 5234530 (1993-08-01), Freeman, III
patent: 5985064 (1999-11-01), Sato
patent: 2002/0046460 (2002-04-01), Mimata et al.
patent: 2006/0054283 (2006-03-01), Yamauchi
patent: 7-161770 (1995-06-01), None
patent: 8-153673 (1996-06-01), None
Elpida Memory Inc.
Koch George
Whithman Curtis Christofferson & Cook, P.C.
LandOfFree
Mounting device and method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mounting device and method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting device and method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3894274