Method of forming pattern

Details Method of forming pattern Method of forming pattern

2007-12-25

2007-12-25

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S706000, C438S720000, C438S736000

Reexamination Certificate

active

11373335

ABSTRACT:
A method of forming a pattern, including forming first and second films, and a resist film on the second film, patterning the resist film to form a first pattern, etching the first pattern to narrow a width of the lines of the first pattern, etching the second film by using the first pattern as a mask to form a second pattern having a configuration of the first pattern transferred thereto, forming a third film above the substrate to cover the second pattern, filling a recessed portion of the third film corresponding to a gap between the lines of the second pattern with a fourth film, and removing a portion of the third film which is located on opposite sides of the fourth film, and a portion of the first film which is located below the third film to form a third pattern.

REFERENCES:
patent: 5795830 (1998-08-01), Cronin et al.
patent: 6063688 (2000-05-01), Doyle et al.
patent: 6475891 (2002-11-01), Moon
patent: 6638441 (2003-10-01), Chang et al.
patent: 6716761 (2004-04-01), Mitsuiki
patent: 2004/0043623 (2004-03-01), Liu et al.
patent: 2005/0016948 (2005-01-01), Yang et al.
patent: 2006/0234165 (2006-10-01), Kamigaki et al.
Mita, T. et al., “Object Detection Apparatus, Learning Apparatus, Object Detection System, Object Detection Method And Object Detection Program,” U.S. Appl. No. 11/362,031, Filed Feb. 27, 2006.

Affiliated with

Also associated with

Rating

Method of forming pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming pattern will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3892231