Semiconductor device, electronic device, electronic...

Details Semiconductor device, electronic device, electronic... Semiconductor device, electronic device, electronic...

2007-08-14

2007-08-14

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21011

Reexamination Certificate

active

11346533

ABSTRACT:
A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK1and PK2are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK1and PK2.The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

REFERENCES:
patent: 5120678 (1992-06-01), Moore et al.
patent: 5222014 (1993-06-01), Lin
patent: 5340771 (1994-08-01), Rostoker
patent: 5755374 (1998-05-01), Prigmore
patent: 5834848 (1998-11-01), Iwasaki
patent: 5973392 (1999-10-01), Senba
patent: 6023097 (2000-02-01), Chiang et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6034425 (2000-03-01), Chiang et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6239383 (2001-05-01), Lin
patent: 6288445 (2001-09-01), Kimura
patent: 6369444 (2002-04-01), Degani et al.
patent: 6369448 (2002-04-01), McCormick
patent: 6404049 (2002-06-01), Shibamoto et al.
patent: 6442026 (2002-08-01), Yamaoka
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6489678 (2002-12-01), Joshi
patent: 6493229 (2002-12-01), Akram et al.
patent: 6501165 (2002-12-01), Farnworth et al.
patent: 6507098 (2003-01-01), Lo et al.
patent: 6531341 (2003-03-01), Peterson et al.
patent: 6573119 (2003-06-01), Hirashima et al.
patent: 6586832 (2003-07-01), Shibata et al.
patent: 6611063 (2003-08-01), Ichinose et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6670264 (2003-12-01), Sakuyama et al.
patent: 6731009 (2004-05-01), Jones et al.
patent: 6774467 (2004-08-01), Horiuchi et al.
patent: 6781241 (2004-08-01), Nishimura et al.
patent: 6787916 (2004-09-01), Halahan
patent: 6882232 (2005-04-01), Harima
patent: 6900074 (2005-05-01), Miyamoto et al.
patent: 6903458 (2005-06-01), Nathan
patent: 2001/0015488 (2001-08-01), Akram et al.
patent: 2001/0025874 (2001-10-01), Nishiyama
patent: 2002/0017709 (2002-02-01), Yanagisawa et al.
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 2003/0022465 (2003-01-01), Wachtler
patent: 2003/0162324 (2003-08-01), Tomimatsu
patent: 2003/0197260 (2003-10-01), Nishimura et al.
patent: 2004/0101993 (2004-05-01), Salmon
patent: 2004/0106229 (2004-06-01), Jiang et al.
patent: 2004/0135243 (2004-07-01), Aoyagi
patent: 2004/0222510 (2004-11-01), Aoyagi
patent: 2004/0238954 (2004-12-01), Miyaji et al.
patent: 06-013541 (1994-01-01), None
patent: 07-183426 (1995-07-01), None
patent: 09-092685 (1997-04-01), None
patent: 09-283697 (1997-10-01), None
patent: 10-084076 (1998-03-01), None
patent: 10-340928 (1998-12-01), None
patent: 11-307717 (1999-11-01), None
patent: 2000-040713 (2000-02-01), None
patent: 2000-286380 (2000-10-01), None
patent: 2001-015633 (2001-01-01), None
patent: 2001-110979 (2001-04-01), None
patent: 2001-223297 (2001-08-01), None
patent: 2001-284382 (2001-10-01), None
patent: 2002-057273 (2002-02-01), None
patent: 2002-134661 (2002-05-01), None
patent: 2002-329813 (2002-11-01), None
patent: 2002-353272 (2002-12-01), None
patent: 2003-007972 (2003-01-01), None
patent: 2003-318361 (2003-11-01), None
patent: 2004-079923 (2004-03-01), None
patent: 2004-214403 (2004-07-01), None
patent: 2004-265955 (2004-09-01), None
patent: 2004-273938 (2004-09-01), None
US 6,120,855, 09/2000, Call et al. (withdrawn)
Communication from Japanese Patent Office regarding related application.
Communication from Japanese Patent Office regarding counterpart application.

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