Process for fabricating a multi layer circuit assembly

Details Process for fabricating a multi layer circuit assembly Process for fabricating a multi layer circuit assembly

2007-06-12

2007-06-12

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S846000, C029S848000, C427S203000, C430S313000

Reexamination Certificate

active

10291876

ABSTRACT:
Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included.

REFERENCES:
patent: 3451793 (1969-06-01), Matsushita
patent: 3469982 (1969-09-01), Celeste
patent: 3738835 (1973-06-01), Bakos
patent: 3934334 (1976-01-01), Hanni
patent: 4137211 (1979-01-01), Angelo et al.
patent: 4343885 (1982-08-01), Reardon, Jr.
patent: 4378264 (1983-03-01), Pilette et al.
patent: 4457956 (1984-07-01), Park
patent: 4592816 (1986-06-01), Emmons et al.
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5153986 (1992-10-01), Brauer et al.
patent: 5166037 (1992-11-01), Atkinson et al.
patent: 5224265 (1993-07-01), Dux et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5232548 (1993-08-01), Ehrenberg et al.
patent: 5242780 (1993-09-01), Lin et al.
patent: 5291066 (1994-03-01), Neugebauer et al.
patent: 5298685 (1994-03-01), Bindra et al.
patent: 5316787 (1994-05-01), Frankeny et al.
patent: 5319158 (1994-06-01), Lee et al.
patent: 5374344 (1994-12-01), Gall et al.
patent: 5574630 (1996-11-01), Kresge et al.
patent: 5590460 (1997-01-01), DiStefano et al.
patent: 5879808 (1999-03-01), Wary et al.
patent: 6030693 (2000-02-01), Boyko et al.
patent: 6105243 (2000-08-01), Okabe et al.
patent: 6150284 (2000-11-01), Kawahara
patent: 6266874 (2001-07-01), DiStefano et al.
patent: 6365844 (2002-04-01), Nishii et al.
patent: 6427325 (2002-08-01), Johansson et al.
patent: 6434819 (2002-08-01), Rokugawa
patent: 0523479 (1992-07-01), None
patent: WO 98/20559 (1998-05-01), None
patent: WO 02/073685 (2002-09-01), None
Beach, W.F., “Xylylene Polymers”,Kirk-Othmer Encyclopedia of Chemical Technology, Supplement Volume, pp. 863-901, 1998.
Beach, W.F., “Xylyene Polymers,”Kirk-Othmer Encyclopedia of Chemical Technology, Supplement Volume, pp. 863-901, 1998.

Affiliated with

Also associated with

Rating

Process for fabricating a multi layer circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating a multi layer circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating a multi layer circuit assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3887108