Integrated passive devices

Semiconductor device manufacturing: process – Making passive device

Reexamination Certificate

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Details

C438S238000, C438S239000

Reexamination Certificate

active

10835338

ABSTRACT:
The specification describes an integrated passive device (IPD) that is formed on a polysilicon substrate. A method for making the IPD is disclosed wherein the polysilicon substrate is produced starting with a single crystal handle wafer, depositing a thick substrate layer of polysilicon on one or both sides of the starting wafer, forming the IPD on one of the polysilicon substrate layers, and removing the handle wafer. In a preferred embodiment the single crystal silicon handle wafer is a silicon wafer rejected from a single crystal silicon wafer production line.

REFERENCES:
patent: 5920764 (1999-07-01), Hanson et al.
patent: 2004/0232107 (2004-11-01), Kouma et al.
patent: 2005/0023590 (2005-02-01), Lian et al.

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