Semiconductor inspection apparatus and manufacturing method...

Details Semiconductor inspection apparatus and manufacturing method... Semiconductor inspection apparatus and manufacturing method...

2007-06-05

2007-06-05

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S756010, C324S757020

Reexamination Certificate

active

11270531

ABSTRACT:
When electrical properties of semiconductor chips of a semiconductor wafer are inspected by bringing plural contact terminals disposed on the principal surface of a probe sheet of a probe cassette constituting a semiconductor inspection apparatus into contact with plural electrodes of the plural semiconductor chips on the principal surface of the semiconductor wafer which is disposed so as to face the principal surface of the probe sheet, the air pressure of the space formed between the facing surfaces of the principal surface of the probe sheet and the principal surface of the semiconductor wafer is reduced so as to suck the semiconductor wafer toward the side of the principal surface of the probe sheet and deform mainly the semiconductor wafer, thereby pressing the plural electrodes of the plural semiconductor chips of the semiconductor wafer against the plural facing contact terminals of the principal surface of the probe sheet.

REFERENCES:
patent: 5945834 (1999-08-01), Nakata et al.
patent: 6265888 (2001-07-01), Hsu
patent: 6340895 (2002-01-01), Uher et al.
patent: 7-283280 (1995-10-01), None
patent: 11-135582 (1999-05-01), None

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