Circuit board, liquid discharge apparatus, and method of...

Details Circuit board, liquid discharge apparatus, and method of... Circuit board, liquid discharge apparatus, and method of...

2007-12-18

2007-12-18

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C439S706000, C347S062000, C216S016000

Reexamination Certificate

active

10929492

ABSTRACT:
Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above the electrode wiring. The method includes: forming an electrode wiring layer for forming the electrode wiring, forming the heating resistor film; and collectively etching the electrode wiring layer and the heating resistor film to thereby form the electrode wiring. With the method according to the present invention, the circuit board can be manufactured with a higher density, higher endurance, and lower power consumption recording head to provide high resolution images.

REFERENCES:
patent: 5870121 (1999-02-01), Chan
patent: 5943070 (1999-08-01), Kamiyama et al.
patent: 6774397 (2004-08-01), Arao et al.
patent: 7053538 (2006-05-01), Ha et al.
patent: 2003/0234833 (2003-12-01), Kim
patent: 9-11468 (1997-01-01), None

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