Measuring and testing – Fluid pressure gauge – Mounting and connection
Reexamination Certificate
2007-12-11
2007-12-11
Allen, Andre J. (Department: 2855)
Measuring and testing
Fluid pressure gauge
Mounting and connection
Reexamination Certificate
active
11495318
ABSTRACT:
According to some embodiments, an apparatus includes a substrate that defines a plane. The apparatus also includes a first conducting plate that is substantially normal to the substrate and a second conducting plate that is (i) substantially normal to the substrate and (ii) deformable in response to a pressure.
REFERENCES:
patent: 4092696 (1978-05-01), Boesen et al.
patent: 4287553 (1981-09-01), Braunlich
patent: 4530029 (1985-07-01), Beristain
patent: 6460234 (2002-10-01), Glanchandani
patent: 2005/0159158 (2005-07-01), Pardeep et al.
patent: 4223616 (1992-07-01), None
patent: 1353161 (2002-10-01), None
EP Search Report Oct. 18, 2005.
J.-S. Park and Y.B. Gianchandani, “A Low Cost Batch-Sealed Capacitive Pressure Sensor,” IEEE No. 0-7803-5194-0 (1999).
A. V. Chavan and K. D. Wise, “A Monolithic Fully-Integrated Vacuum-Sealed CMOS Pressure Sensor,” IEEE No. 0-7803-5273-4 (2000).
Wen H. Ko and Qiang Wang, “Touch Mode Capacitive Pressure Sensors For Industrial Applications,” IEEE No. 0-7803-3744-1 (1997).
Hyeoncheol Kim and Kukjin Chun, “Integrated MEMS for Pressure Transponder,” 1997 International Conference on Solid-State Sensors and Actuators, IEEE No. 0-7803-3829-4 (1997).
W. P. Eaton and J. H. Smith, “Micromachined Pressure Sensors: Review and Recent Developments,” Smart Mater. Struct. 6, p. 530-539 (1997).
Abhijeet V. Chavan and Kensall D. Wise, “A Monolithic Fully-Integrated Vacuum-Sealed CMOS Pressure Sensor,” IEEE Transactions on Electron Devices, vol. 49, No. 1 (Jan. 2002).
C. Hierold et al., “Implantable Low Power Integrated Pressure Sensor System for Minimal Invasive Telemetric Patient Monitoring,” IEEE No. 0-7803-4412-X (1999).
Fortin Jeffrey
Kishore Kuna
Subramanian Kanakasabapathi
Allen Andre J.
Brueske Curtis B.
General Electric Company
Powell, III William E.
LandOfFree
Microelectromechanical system pressure sensor and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microelectromechanical system pressure sensor and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectromechanical system pressure sensor and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3884504