Method of fabricating power semiconductor device and lead frame

Details Method of fabricating power semiconductor device and lead frame Method of fabricating power semiconductor device and lead frame

1996-06-05

1998-08-11

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438112, 438113, 257670, 257672, 257674, 257676, 257692, H01L 2128

Patent

active

057926760

ABSTRACT:
Disclosed herein are a method of fabricating a power semiconductor device having joiners that (205) vertically extend from outer sides of leads (203, 204) of a tie bar (201) of a power circuit lead frame (20) respectively, while joiners (308) vertically extend from outer sides of leads (303, 307) of a tie bar (301) of a control circuit lead frame (30) respectively to be opposed thereto. Forward end portions (205a) of the joiners (205) are joined to rear surfaces of forward end portions (308a) of the joiners (308) at a device center portion.

REFERENCES:
patent: 4794431 (1988-12-01), Park
patent: 5147815 (1992-09-01), Casto
patent: 5313095 (1994-05-01), Tagawa et al.
patent: 5438021 (1995-08-01), Tagawa et al.

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