Support and grounding structure

Details Support and grounding structure Support and grounding structure

2007-06-19

2007-06-19

Ta, Tho D. (Department: 2833)

Electrical connectors

With provision to dissipate, remove, or block the flow of heat

Distinct heat sink

C174S016300, C361S709000

Reexamination Certificate

active

10337500

ABSTRACT:
Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heat sink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heat sink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heat sink, counter directional to the bias from the load spring.

REFERENCES:
patent: 6205026 (2001-03-01), Wong et al.
patent: 6442045 (2002-08-01), Goodwin et al.
patent: 6477058 (2002-11-01), Luebs et al.
patent: 6563213 (2003-05-01), Wong et al.
patent: 6579120 (2003-06-01), Abbott
patent: 6724632 (2004-04-01), Lee et al.
patent: 6746270 (2004-06-01), Peterson et al.
patent: 2002/0186537 (2002-12-01), Freuler et al.
patent: 2004/0075982 (2004-04-01), Kim et al.
patent: 2004/0120119 (2004-06-01), Lee et al.

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