Thermoplastic polyamide moulding compositions

Details Thermoplastic polyamide moulding compositions Thermoplastic polyamide moulding compositions

2007-12-25

2007-12-25

Woodward, Ana (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C524S099000, C524S104000, C524S155000, C524S156000, C524S158000, C524S169000, C525S066000, C525S183000, C525S420000, C525S425000, C525S430000, C525S431000, C525S433000

Reexamination Certificate

active

11026243

ABSTRACT:
The present invention relates to thermoplastic polyamide moulding compositions which contain at least one copolyamide with at least 20% by weight polyamide 12 components and at least one aprotic compound selected from the group of N-alkylated, cyclic carboxylic acid amides with 5 to 7 ring elements and/or of urea derivatives, the alkyl rests of which are linear at the nitrogen or which form a linking of the two N-atoms, and a process for production of the moulding compositions. The thermoplastic polyamide moulding compositions are distinguished by the fact that no solid deposits are formed during thermoplastic conversion.

REFERENCES:
patent: 4711925 (1987-12-01), Mumcu et al.
patent: 5756647 (1998-05-01), Schmid et al.
patent: 6506830 (2003-01-01), Bussi et al.
patent: 6753363 (2004-06-01), Harashina
patent: 0469542 (1992-02-01), None
patent: 0469542 (1992-02-01), None
patent: 0748 847 (1996-12-01), None
patent: WO 97/10303 (1997-03-01), None
patent: WO 01/05888 (2001-01-01), None
patent: 2005/000953 (2005-01-01), None

Affiliated with

Also associated with

Rating

Thermoplastic polyamide moulding compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoplastic polyamide moulding compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoplastic polyamide moulding compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3883963