Method of manufacturing circuit forming board to improve...

Details Method of manufacturing circuit forming board to improve... Method of manufacturing circuit forming board to improve...

2007-08-07

2007-08-07

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S829000, C029S830000, C029S846000, C029S853000, C174S250000, C174S264000, C174S266000, C428S209000, C428S304400

Reexamination Certificate

active

10770426

ABSTRACT:
In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the board. When a laser beam is applied to form a throughhole in the board, a unified portion of the board and the separation film is formed around the throughhole. An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.

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