Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-02-27
2007-02-27
Reichard, Dean A. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S256000, C361S790000, C257SE23021, C257S781000, C257S782000, C257S783000, C257S786000, C438S613000, C438S614000, C438S615000, C438S616000, C438S617000
Reexamination Certificate
active
10829060
ABSTRACT:
A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.
REFERENCES:
patent: 5407506 (1995-04-01), Goetz et al.
patent: 5427638 (1995-06-01), Goetz et al.
patent: 5714252 (1998-02-01), Hogerton et al.
patent: 5889326 (1999-03-01), Tanaka
patent: 6309737 (2001-10-01), Hirashima et al.
patent: 6333104 (2001-12-01), Perry et al.
patent: 6337522 (2002-01-01), Kang et al.
patent: 6373714 (2002-04-01), Kudoh et al.
patent: 6586322 (2003-07-01), Chiu et al.
patent: 6618269 (2003-09-01), Chen
patent: 6739027 (2004-05-01), Lauffer et al.
patent: 6740823 (2004-05-01), Shimizu
patent: 6744142 (2004-06-01), Liu et al.
patent: 6858111 (2005-02-01), Perry et al.
patent: 6872984 (2005-03-01), Leung
patent: 7069645 (2006-07-01), Ishikawa et al.
patent: 2003/0005582 (2003-01-01), Tatoh et al.
Chang Shu-Ming
Chang Shyh-Ming
Huang Yuan-Chang
Lin Yao-Sheng
Lu Su-Tsai
Industrial Technology Research Institute
Nguyen Hoa C.
Reichard Dean A.
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